TN SUBSTRATE SPECIFICATION (NO S SHAPED VARIATION IS ALLOWED)
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Thickness
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Width/Length
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Thickness Tolerance
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Squareness
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Warp
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Roughness
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0.4mm
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± 0.2mm
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±0.05mm
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0.1%
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0.15%
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0.3mkm/20mm
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0.55mm
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± 0.2mm
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±0.05mm
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0.1%
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0.10%
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0.25mkm/20mm
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0.7mm
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± 0.2mm
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±0.05mm
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0.1%
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0.10%
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0.20mkm/20mm
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1.1mm
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± 0.2mm
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±0.10mm
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0.1%
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0.10%
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0.15mkm/20mm
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STN SUBSTRATE SPECIFICATION
STN Substrate specification The dimension specification of STN substrate is same as TN type, but the roughness specification is required as follow:
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Thickness
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Super polished (Å/20mm)
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Normal polished (Å/20mm)
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Rough polished (Å/20mm)
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1.1mm
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Rt<400
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400<Rt<500
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500<Rt<800
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0.7mm
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Rt<400
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400<Rt<800
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800<Rt<1000
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0.55mm
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Rt<600
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600<Rt<1000
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1000<Rt<1800
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0.4mm
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Rt<1000
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1000<Rt<1500
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1500<Rt<2500
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Thickness
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Easy to be polished (Å/20mm)
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Thickness
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Easy to be polished (Å/20mm)
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1.1mm
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800<Rt<1000
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0.7mm
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1000<Rt<1300
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DEFECT SPECIFICATION OF NORMAL SUBSTRATE (TN TYPE)
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NO.
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Characteristic
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Specification Limits
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1
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Areal bulk defects d=(W+L)/2
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d<0.05mm ignore
0.05<d<0.5mm 4/pcs at most
d>0.5mm none allowed
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2
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Elongated bulk defects
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W<0.03mm ignore
0.03<W<0. 1mm 1/pcs, length is less than 2mm.
W>0.1mm none allowed
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3
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Areal Surface defects d=(L+W)/2
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d<0.05mm ignore
0.05<d<0.5mm 4/pcs at most
d>0.5mm none allowed
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4
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Scratches
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W<0.03mm ignore
0.03<W<0.1mm tin side: total length <25mm/pcs air side: total length <50mm/pcs
W>0.1mm none allowed
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5
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Critical Area
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The total area except a 3mm border.
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6
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contamination
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No contamination is allowed if it can't be removed by normal washing agent.
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Defect specification of polished substrate (STN type), including easy to be polished, normal polished and super polished substrate.
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NO.
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Characteristic
|
Specification Limits
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|
1
|
Areal bulk defects d=(W+L)/2
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d<0.03mm ignore 0.03<d<0.2mm 4/pcs at most d>0.2mm none allowed
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2
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Elongated bulk defects
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W<0.01mm ignore 0.01<W<0.03mm 1/pcs, length is less than 2mm. W>0.03mm none allowed
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3
|
Areal Surface defects d=(L+W)/2
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d<0.03mm ignore 0.03<d<0.2mm 2/pcs at most d>0.2mm none allowed
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4
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Scratches
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polished side: W<0.01mm ignore 0.01<W<0.03mm total length less than 2mm/pcs W>0.03mm none allowed air side: W<0.03mm ignore 0.03<W<0. 1mm total length less than 50mm/pcs W>0.1mm none allowed
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5
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Critical Area
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The total area except a 3mm border.
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6
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contamination
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No contamination is allowed if it can't be removed by normal washing agent.
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7
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water mark and burn of polishing
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None
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8
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polishing pit
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No polishing pit is allowed if it affect the roughness or surface qualities of substrate.
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EDGE SEAM AND CORNER DUB DIAGRAM
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a=1.5±0.5mm, b=2.0±0.5mm, c=5.0±1.0mm, A=0.18-1.0mm, h=0.1-0.3mm
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NO.
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Characteristic
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Specification Limits
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Measurement Method
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|
1
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Edge Seam
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Fillet: 0.18 <h< 1.0mm
Chamfer: 0.1 < h < 0.3mm
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10x Magnifying glass or Projecting apparatus
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2
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Orientation Corner
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X=2.0 ± 0.5mm
Y=5.0 ±1.0mm
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10x Magnifying glass or Projecting apparatus
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3
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Corner dub
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1.5 ±0.5mm
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10x Magnifying glass or Projecting apparatus
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4
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Edge Chips
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Length < 3mm, width < 1.5mm
Depth < 1/2 glass thickness
Total length < 10% of edge length
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10x Magnifying glass or Projecting apparatus
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5
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Fractures
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None allowed
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Bare eyes
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6
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Edge not seamed
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None allowed
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Bare eyes
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Transmittance shall be greater than or equal to 90% at 550nm.
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TRANSMITTANCE
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- Silicon Dioxide (SiO2) Barrier Coating Specification
The thickness of SiO2 Barrier Coating: 250Å ± 50 Å
- Barrier efficiency:
The barrier efficiency is tested in DI water at 96oC for 48 hours. The mass of Na ion passing through the barrier should less than 10mkg/dm2.
- Transmittance:
The transmittance of 1.1mm substrate with SiO2 coating should be greater than or equal to 90% at 550nm.
- SiO2 coating surface quality:
The surface of SiO2 coating is permitted to have few pinholes, voids and particles etc., but the quantity and size of defects is limited as follow:
Lose film: none allowed
Stains: none allowed
Haze: none allowed
Scratches: none allowed
Pinholes/Voids/P articles:
Defect diameter (Length +width)/2 Limitation
>0.2mm none allowed
0.03-0.2mm 4/piece
<0.03mm ignore
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INDIUM TIN DIOXIDE(ITO) COATING SPECIFICATION
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- Critical area ITO film covers the total substrate area except a 3mm border. There are four position in the 3mm border where used to support the substrate when coating ITO film.
- Film thickness:
The normal thickness of different types product is listed in table I.
- Transmittance:
Table I shows the minimum transmittance of various thickness of ITO film at 550nm.
- Electrical conductivity:
Table I shows the sheet resistivity of various thickness of ITO film.
- Etch property:
Table I shows the maximum etch time of various thickness of ITO film.
- Thermostalility:
The final sheet resistivity of ITO film should be no more than 300% of original value after a temperature cycle of heat up at 500oC for 30 minutes in air ambient and cool down in air too.
- ITO coating surface quality:
The surface of ITO coating is permitted to have few pinholes, voids and particles etc., but the quantity and size of defects is limited as follow:
Lose film: none allowed
Stains: none allowed
Haze: none allowed
Scratches: none allowed
Pinholes/Voids/P articles:
Defect diameter (Length +width)/2 Limitation
>0.2mm none allowed
0.03-0.2mm 4/piece
<0.03mm ignore
- Stability:
- Chemical Resistance
- The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in 10%wt solution of NaOH at 60oC for 5 minutes.
- The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in 6%wt solution of HCl at 25oC for 2 minutes.
- The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in alcohol, acetone etc. for 5 minutes.
- Adhesion
The coating should exhibit no damage or change in appearance when putting 3M tape on film surface firmly and then removing it quickly. The sheet resistivity should not exceed 110% of original resistivity
- Abrasion
The film should not be removed so as to cause an opened circuit following a 100 times of rub erasing test with 1kg of applied force
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TYPES AND SPECIFICATION OF ITO PRODUCT
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Type
|
Thickness and Uniformity
of ITO film
(Å)
|
Transmittance (T%)
|
Sheet Resistivity (Ohm/□)
|
Etch Time (s)
|
|
--017(HT)
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150±30
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≥90
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≤180
|
<30
|
|
--017
|
150±30
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≥88
|
≤200
|
<30
|
|
--20
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200±50
|
≥87
|
≤150
|
<30
|
|
--25
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250±50
|
≥87
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≤100
|
<30
|
|
--30
|
300±50
|
≥87
|
≤80
|
<35
|
|
--35
|
350±50
|
≥85
|
≤60
|
<60
|
|
--40
|
400±50
|
≥83
|
≤50
|
<60
|
|
--45
|
450±50
|
≥83
|
≤45
|
<60
|
|
--50
|
500±100
|
≥82
|
≤40
|
<60
|
|
--70
|
700±100
|
≥81
|
≤30
|
<100
|
|
--90
|
900±100
|
≥80
|
≤20
|
<120
|
|
--125
|
1250±200
|
≥85
|
≤17
|
<150
|
|
--150
|
1500±200
|
≥86
|
≤15
|
<200
|
|
--200
|
2000±250
|
≥80
|
≤10
|
<250
|
| The Others |
According to customer's specification |
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INSPACTION AND TEST METHODS
|
| NO. |
Characteristic |
Tools and methods of inspection |
| 1 |
Surface quality |
Inspection should be conducted with unaided eyes at a distance of 30cm or so from the sample under 10K LUX fluorescent lamp (50W special lamp added for STN type substance) in black background |
| 2 |
Length and Width |
Caliper |
| |
Thickness |
Dial gauge |
| 4 |
Edge and Corner |
Magnifying glass or Projecting apparatus |
| 5 |
Squareness |
Measurement apparatus for squareness |
| 6 |
Warp |
Dot board |
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MARKING STRUCTURE
|
|
THE SIGN OF ITO GLASS SUBSTRATE FOR LCD APPLICATION
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TN - used for normal LCD (not polished)
-
-
(S)TN - float plus substrate (equal to RSTN)
-
-
-
HTTN - high transmittance TN type
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SUBSTRATE CODE
-
-
-
-
-
|
