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Glass CSG with ITO

TN SUBSTRATE SPECIFICATION (NO S SHAPED VARIATION IS ALLOWED)

Thickness

Width/Length

Thickness Tolerance

Squareness

Warp

Roughness

0.4mm

± 0.2mm

±0.05mm

0.1%

0.15%

0.3mkm/20mm

0.55mm

± 0.2mm

±0.05mm

0.1%

0.10%

0.25mkm/20mm

0.7mm

± 0.2mm

±0.05mm

0.1%

0.10%

0.20mkm/20mm

1.1mm

± 0.2mm

±0.10mm

0.1%

0.10%

0.15mkm/20mm

STN SUBSTRATE SPECIFICATION

STN Substrate specification The dimension specification of STN substrate is same as TN type, but the roughness specification is required as follow:

Thickness

Super polished (Å/20mm)

Normal polished (Å/20mm)

Rough polished (Å/20mm)

1.1mm

Rt<400

400<Rt<500

500<Rt<800

0.7mm

Rt<400

400<Rt<800

800<Rt<1000

0.55mm

Rt<600

600<Rt<1000

1000<Rt<1800

0.4mm

Rt<1000

1000<Rt<1500

1500<Rt<2500

Thickness

Easy to be polished (Å/20mm)

Thickness

Easy to be polished (Å/20mm)

1.1mm

800<Rt<1000

0.7mm

1000<Rt<1300

DEFECT SPECIFICATION OF NORMAL SUBSTRATE (TN TYPE)

NO.

Characteristic

Specification Limits

1

Areal bulk defects d=(W+L)/2

d<0.05mm ignore

0.05<d<0.5mm 4/pcs at most

d>0.5mm none allowed

2

Elongated bulk defects

W<0.03mm ignore

0.03<W<0. 1mm 1/pcs, length is less than 2mm.

W>0.1mm none allowed

3

Areal Surface defects d=(L+W)/2

d<0.05mm ignore

0.05<d<0.5mm 4/pcs at most

d>0.5mm none allowed

4

Scratches

W<0.03mm ignore

0.03<W<0.1mm tin side: total length <25mm/pcs air side: total length <50mm/pcs

W>0.1mm none allowed

5

Critical Area

The total area except a 3mm border.

6

contamination

No contamination is allowed if it can't be removed by normal washing agent.

Defect specification of polished substrate (STN type), including easy to be polished, normal polished and super polished substrate.

NO.

Characteristic

Specification Limits

1

Areal bulk defects d=(W+L)/2

d<0.03mm ignore 0.03<d<0.2mm 4/pcs at most d>0.2mm none allowed

2

Elongated bulk defects

W<0.01mm ignore 0.01<W<0.03mm 1/pcs, length is less than 2mm. W>0.03mm none allowed

3

Areal Surface defects d=(L+W)/2

d<0.03mm ignore 0.03<d<0.2mm 2/pcs at most d>0.2mm none allowed

4

Scratches

polished side: W<0.01mm ignore 0.01<W<0.03mm total length less than 2mm/pcs W>0.03mm none allowed air side: W<0.03mm ignore 0.03<W<0. 1mm total length less than 50mm/pcs W>0.1mm none allowed

5

Critical Area

The total area except a 3mm border.

6

contamination

No contamination is allowed if it can't be removed by normal washing agent.

7

water mark and burn of polishing

None

8

polishing pit

No polishing pit is allowed if it affect the roughness or surface qualities of substrate.

EDGE SEAM AND CORNER DUB DIAGRAM

 

 

a=1.5±0.5mm, b=2.0±0.5mm, c=5.0±1.0mm, A=0.18-1.0mm, h=0.1-0.3mm

NO.

Characteristic

Specification Limits

Measurement Method

1

Edge Seam

Fillet: 0.18 <h< 1.0mm

Chamfer: 0.1 < h < 0.3mm

10x Magnifying glass or Projecting apparatus

2

Orientation Corner

X=2.0 ± 0.5mm

Y=5.0 ±1.0mm

10x Magnifying glass or Projecting apparatus

3

Corner dub

1.5 ±0.5mm

10x Magnifying glass or Projecting apparatus

4

Edge Chips

Length < 3mm, width < 1.5mm

Depth < 1/2 glass thickness

Total length < 10% of edge length

10x Magnifying glass or Projecting apparatus

5

Fractures

None allowed

Bare eyes

6

Edge not seamed

None allowed

Bare eyes

Transmittance shall be greater than or equal to 90% at 550nm.

TRANSMITTANCE

 
  1. Silicon Dioxide (SiO2) Barrier Coating Specification
    The thickness of SiO2 Barrier Coating: 250Å ± 50 Å 
  2. Barrier efficiency:
    The barrier efficiency is tested in DI water at 96oC for 48 hours. The mass of Na ion passing through the barrier should less than 10mkg/dm2.
  3. Transmittance:
    The transmittance of 1.1mm substrate with SiO2 coating should be greater than or equal to 90% at 550nm. 
  4. SiO2 coating surface quality:
    The surface of SiO2 coating is permitted to have few pinholes, voids and particles etc., but the quantity and size of defects is limited as follow:
    Lose film: none allowed
    Stains: none allowed
    Haze: none allowed
    Scratches: none allowed
    Pinholes/Voids/P articles:
    Defect diameter (Length +width)/2        Limitation
    >0.2mm                                            none allowed
    0.03-0.2mm                                      4/piece
    <0.03mm                                          ignore

 INDIUM TIN DIOXIDE(ITO) COATING SPECIFICATION

 
  1. Critical area ITO film covers the total substrate area except a 3mm border. There are four position in the 3mm border where used to support the substrate when coating ITO film. 
  2. Film thickness:
    The normal thickness of different types product is listed in table I. 
  3. Transmittance:
    Table I shows the minimum transmittance of various thickness of ITO film at 550nm.
  4. Electrical conductivity:
    Table I shows the sheet resistivity of various thickness of ITO film.
  5. Etch property:
    Table I shows the maximum etch time of various thickness of ITO film.
  6. Thermostalility:
    The final sheet resistivity of ITO film should be no more than 300% of original value after a temperature cycle of heat up at 500oC for 30 minutes in air ambient and cool down in air too. 
  7. ITO coating surface quality:
    The surface of ITO coating is permitted to have few pinholes, voids and particles etc., but the quantity and size of defects is limited as follow:
    Lose film: none allowed
    Stains: none allowed
    Haze: none allowed
    Scratches: none allowed
    Pinholes/Voids/P articles:
    Defect diameter (Length +width)/2      Limitation
    >0.2mm                                          none allowed
    0.03-0.2mm                                    4/piece
    <0.03mm                                        ignore
  8. Stability:
    • Chemical Resistance
      • The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in 10%wt solution of NaOH at 60oC for 5 minutes. 
      • The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in 6%wt solution of HCl at 25oC for 2 minutes.
      • The sheet resistivity of ITO film should not exceed 110% of original resistivity after soaking in alcohol, acetone etc. for 5 minutes.
    • Adhesion
      The coating should exhibit no damage or change in appearance when putting 3M tape on film surface firmly and then removing it quickly. The sheet resistivity should not exceed 110% of original resistivity 
    • Abrasion
      The film should not be removed so as to cause an opened circuit following a 100 times of rub erasing test with 1kg of applied force

TYPES AND SPECIFICATION OF ITO PRODUCT

Type

Thickness and Uniformity

of ITO film

(Å)

Transmittance (T%)

Sheet Resistivity (Ohm/□)

Etch Time (s)

--017(HT)

150±30

≥90

≤180

<30

--017

150±30

≥88

≤200

<30

--20

200±50

≥87

≤150

<30

--25

250±50

≥87

≤100

<30

--30

300±50

≥87

≤80

<35

--35

350±50

≥85

≤60

<60

--40

400±50

≥83

≤50

<60

--45

450±50

≥83

≤45

<60

--50

500±100

≥82

≤40

<60

--70

700±100

≥81

≤30

<100

--90

900±100

≥80

≤20

<120

--125

1250±200

≥85

≤17

<150

--150

1500±200

≥86

≤15

<200

--200

2000±250

≥80

≤10

<250

The Others         According to customer's specification

 INSPACTION AND TEST METHODS

NO. Characteristic Tools and methods of inspection
1 Surface quality Inspection should be conducted with unaided eyes at a distance of 30cm or so from the sample under 10K LUX fluorescent lamp (50W special lamp added for STN type substance) in black background
2 Length and Width Caliper
  Thickness Dial gauge
4 Edge and Corner Magnifying glass or Projecting apparatus
5 Squareness Measurement apparatus for squareness
6 Warp Dot board

MARKING STRUCTURE

 

 

THE SIGN OF ITO GLASS SUBSTRATE FOR LCD APPLICATION


  • TN - used for normal LCD (not polished)

  • RSTN - rough polished

  • (S)TN - float plus substrate (equal to RSTN)

  • STN - normal polished

  • SSTN - super polished

  • HTTN - high transmittance TN type

 

 

SUBSTRATE CODE

 

  1. glaverbel

  2. NSG 

  3. ASAHI

  4. CENTRAL 

  5. PILKINTON